Inari Technology Sdn Bhd, it is an EMS company supplying semiconductor SiP
packaging to the OEMs, which in turn sell them as RF semiconductors to the cellular phone
manufacturers, as well as network product manufacturers. Finally, these manufacturers
incorporated these RF semiconductors into the RF module during the production process of
the cellular phones and network products.
It is quite common for EMS companies such as Inari Technology Sdn Bhd, to rely
heavily on a single customer for the majority of their revenues, particularly in the early years,
prior to expanding their customer base. The sales are guaranteed within a captive market in
a set time span, with little marketing expenses involved. Eventually, the EMS companies are
able to diversify their base of customers over a period of time.
This strategic and symbiotic relationship assists to ensure greater efficiencies among
both the OEMs and EMS companies, through very close interactions. In return, the EMS
companies would continue to benefit from the outsourcing processes of the OEMs.
Meanwhile, the OEMs is given the flexibility and do not need to ramp up their production
capacities and inventory exposure, when there is a sudden surge in orders, through
outsourcing the work to the EMS companies. This outsourcing model is advantageous for
OEMs which lack the resources to engage in vertically integrated manufacturing
.
Semiconductor manufacturing may be defined as the process of producing a silicon
wafer from pure silicon, fabricating the IC onto the silicon wafer, followed by assembling
the fabricated wafer onto a package and finally testing the chip for proper functioning.
Typically, semiconductor manufacturing comprises Production of silicon wafer from
very pure silicon ingots, fabrication of ICs onto these silicon wafers, assembly of every IC
on the wafer into a finished product, and lastly testing and back-end processing of the finished
product or device. Whereby, the first two steps from the front end side of semiconductor
manufacturing and the later two (2) steps form the back end side of semiconductor
manufacturing. In particular, Inari Technology Sdn Bhd is involved in back end wafer
processing, package assembly and RF final testing services in the back end side of the
semiconductor industry.
packaging to the OEMs, which in turn sell them as RF semiconductors to the cellular phone
manufacturers, as well as network product manufacturers. Finally, these manufacturers
incorporated these RF semiconductors into the RF module during the production process of
the cellular phones and network products.
It is quite common for EMS companies such as Inari Technology Sdn Bhd, to rely
heavily on a single customer for the majority of their revenues, particularly in the early years,
prior to expanding their customer base. The sales are guaranteed within a captive market in
a set time span, with little marketing expenses involved. Eventually, the EMS companies are
able to diversify their base of customers over a period of time.
This strategic and symbiotic relationship assists to ensure greater efficiencies among
both the OEMs and EMS companies, through very close interactions. In return, the EMS
companies would continue to benefit from the outsourcing processes of the OEMs.
Meanwhile, the OEMs is given the flexibility and do not need to ramp up their production
capacities and inventory exposure, when there is a sudden surge in orders, through
outsourcing the work to the EMS companies. This outsourcing model is advantageous for
OEMs which lack the resources to engage in vertically integrated manufacturing
.
Semiconductor manufacturing may be defined as the process of producing a silicon
wafer from pure silicon, fabricating the IC onto the silicon wafer, followed by assembling
the fabricated wafer onto a package and finally testing the chip for proper functioning.
Typically, semiconductor manufacturing comprises Production of silicon wafer from
very pure silicon ingots, fabrication of ICs onto these silicon wafers, assembly of every IC
on the wafer into a finished product, and lastly testing and back-end processing of the finished
product or device. Whereby, the first two steps from the front end side of semiconductor
manufacturing and the later two (2) steps form the back end side of semiconductor
manufacturing. In particular, Inari Technology Sdn Bhd is involved in back end wafer
processing, package assembly and RF final testing services in the back end side of the
semiconductor industry.